Big Dimension Medium High Hardness Polishing Pad with Retaining Ring for Semiconductor Wafer Waxless Design and Slurry Control
Price varies depending on material, logo, quantity and customization requirements.
Introduction
| Type | Wafer Processing | Material | Polyurethane Composite with Plastic Ring |
| Product Type | Large Size CMP Polishing Pad with Retaining Ring | Application | Large Diameter SiC/Silicon Wafer |
| Characteristic 1 | Integrated Retaining Ring for Slurry Control | Characteristic 2 | Waxless Design, Custom Size Available |
| Size & Thickness | Custom Large Diameter Available | Hardness | Medium-High |
| Color | Grey Pad with Blue Retaining Ring | Processing Method | Precision Molded & Cut |
| OEM Service | Custom Ring & Pad Dimension Available |
We are a professional manufacturer and supplier, dedicated to maintaining consistent quality and establishing long-term partnerships with clients worldwide.
Our mission is to provide high-quality products and reliable service. We are committed to offering the following advantages:
- Stable production system ensuring consistent quality, dependable supply, and standardized manufacturing management;
- Strict quality control covering material selection, processing, surface finishing, and final packaging;
- Variety of products and specifications to meet diverse project requirements and application scenarios;
- OEM & customization support based on drawings, samples, or specific technical requirements;
- Flexible packaging solutions to ensure safe handling and transportation of products;
- Continuous improvement in products and services to better support customers in different markets.
If you are interested in our products, please feel free to contact us. We look forward to establishing long-term and mutually beneficial cooperation with you.