IGBT Wafer 1200V 50A China Transistor Chip 8 Inch Wafer Bare Die High Yield Steel Bar for Welding Machine and Induction Heating
Price varies depending on material, logo, quantity and customization requirements.
Introduction
| Type | IGBT | Application | Welding Machine and Induction Heating |
| Package Type | Bare Die | Media Available | Datasheet, Photo |
| Supplier Type | Original Manufacturer, ODM | Package / Case | bare die |
| Description | Trench FS technology, Positive temperature coefficient, Low switching losses, Easy paralleling | Manufacturer Part Number | AKGW50T120HA |
| Operating Temperature | -40℃~+175℃ | Current - Collector (Ic) (Max) | 50A |
| Voltage - Collector Emitter Breakdown (max) | 1200V | Vce Saturation (Max) @ Ib, Ic | 2.59V |
| Current Rating (Amps) | 50A | Voltage - Rated | 1200V |
| IGBT Type | Trench-FS | Input Capacitance (Cies) @ Vce | 2.99nF |
| Transistor Type | IGBT wafer | Mounting Type | built-in |
| Wafer Size | 8 inch | Wafer Thickness | 125um |
| Max. possible chips per wafer | 520 | Scribe Line | 80um |
| DC collector current | 50A | VCE(sat) at Ic=40A | 2.19-2.59V |
| Collector-Emitter voltage | 1200V | VGE(th) | 5.2-6.4V |
| Cies | 2.99nF | Cres | 0.13nF |
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- Stable production system ensuring consistent quality, dependable supply, and standardized manufacturing management;
- Strict quality control covering material selection, processing, surface finishing, and final packaging;
- Variety of products and specifications to meet diverse project requirements and application scenarios;
- OEM & customization support based on drawings, samples, or specific technical requirements;
- Flexible packaging solutions to ensure safe handling and transportation of products;
- Continuous improvement in products and services to better support customers in different markets.
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