Custom Size OEM Silicon Carbide Polishing Pad for Wafer Lapping and Grinding with Precision Thickness Waxfree Design Custom Grit
$28.60
/piece
Price varies depending on material, logo, quantity and customization requirements.
Quality You Can Trust
Flexible & Scalable Solutions
Customizable Product Options
Comprehensive Specifications
Your Reliable Business Partner
Category:
Silicon Wafer
Introduction
| application | Grinding | grit | 0.5μm~50μm / Customized Grit Available |
| Abrasive Grade | Medium | Shape | Disc |
| customized support | OEM | Thickness | Customized Per Client Drawing(Wax Free Design) |
| Process | Wax-free Wafer Polishing Design | Usage | CMP Lapping for Semiconductor Wafer |
| Feature | Custom Groove/Size/Density Supported |
We are a professional manufacturer and supplier, dedicated to maintaining consistent quality and establishing long-term partnerships with clients worldwide.
Our mission is to provide high-quality products and reliable service. We are committed to offering the following advantages:
- Stable production system ensuring consistent quality, dependable supply, and standardized manufacturing management;
- Strict quality control covering material selection, processing, surface finishing, and final packaging;
- Variety of products and specifications to meet diverse project requirements and application scenarios;
- OEM & customization support based on drawings, samples, or specific technical requirements;
- Flexible packaging solutions to ensure safe handling and transportation of products;
- Continuous improvement in products and services to better support customers in different markets.
If you are interested in our products, please feel free to contact us. We look forward to establishing long-term and mutually beneficial cooperation with you.
